|
THERMAN
v2.0 main features |
| Structure
model: |
cubic
structure built of homogenous material layers, 2D polygon-like dissipating
and/or heat removing shapes at any horizontal interface + compact
dynamic RC models of IC packages |
| Complexity
of dissipater layout: |
Unlimited |
| Number
of layers: |
Unlimited
in the solver, 10 in the GUI |
| Basic
solution algorithm: |
Fourier
method, realized by FFT |
| FFT
grid resolution on the surface: |
From
128 x 128 up to 1024 x 1024 |
| Boundary
conditions at side-walls: |
Any
combination of adiabatic and isothermal |
| Boundary
conditions at bottom/top surfaces: |
Adiabatic,
isothermal or natural convection |
| Analysis
types: |
Steady-state,
frequency-domain & time-constant spectrum
calculation, transient simulation ,
coming soon: calculation of thermal
dominance map of all components |
| Complementary
algorithms: |
nonlinear
thermal conductivity considered by the Kirchhof-transform, co-simulation
with compact dynamic RC models |
| Other
features: |
Material
database,
IC-package library for PCB simulations
with compact dynamic RC models
, HTML documentation of
simulation results |
| Graphical
User Interface (GUI): |
The
same on Win32 and Unix platforms with HTML
On-Line Manual |
| Supported
platforms: |
Win32,
SUN-Solaris |
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