THERMAN - thermal field solver |
THERMAN is a thermal field solver program based on the Fourier method, aimed
at the calculation of the temperature distribution in rectangular
shaped, multi-layer structures (such as IC chips, MCM-s, PC boards
and some MEMS structures). The Fourier method allows very
fast calculation of the thermal field, with negligible limits
of accuracy which are due to some inherent constraints of the model.
A
world-novelty, the co-simulation
of RC package dynamic compact models with the detailed thermal models
of PWB-s in THERMAN is available in version 2.0.
THERMAN v2.0 - many new features including co-simulation of RC
compact dynamic package models with the PWB model.
Introduction
to the public took place at SEMI-THERM 2002!
About THERMAN 2.0 in the press... |
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