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This document describes the main characteristics of thermal
test chips manufactured or distributed by MicReD. Due to continuous development,
listed types may become obsolete and specifications are subject to change.
Customized versions of existing and planned chip types are also available
in larger quantities. Wafers can be ordered with different arraying options
and interchip metallisation. Composite wafers of different chip types
of the same family are also available. Contact
us for further details.
Standard thermal test chips
Standard test chips contain a resistive dissipator element
and a diode type analogue sensor. Standard test chips can be used for
package characterization or for emulation of actual chips of similar size
and dissipation level.
Some standard test chips are designed for being used in
larger monolithic chip arrays, assuring large device size and high powering
level.
Thermal transient measurements on standard test chips can
be carried out by tester appliances like the T3Ster
equipment of MicReD.
Pad arrangements enable using force and sense pins on resistors
for accurate powering (Figure 1a). Arrayed chips can
be also used with a force/sense diode pin arrangement (Figure
1b).
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| a) |
b) |
Figure 1: Force and sense pins of standard
test chips
Figure 2 shows a typical scheme for
driving a resistive dissipator by a thermal transient tester equipment.
Figure 2: Powering in a thermal transient tester equipment
Packages with a minimum pin count of three can be characterized
with standard test chips. Force/sense arrangements are possible with more
pins only. Packages with two pins can be characterized using the substrate
diode of the chip for powering and measurement.
Standard test chips in MicReD's thermal test die selection
are manufactured at major European semiconductor companies like ST Microelectronics
and Infineon.
Different software products can be ordered for evaluating
the results gained from the transient measurements. These provide the
results in various formats such as pulse thermal resistance diagrams,
time-constant spectra, structure functions, dynamic compact models, etc.
(Figure 3 to Figure 5). The measurement control & evaluation software
of the T3Ster
equipment provides a powerful set of embedded
evaluation tools.
Figure 3: Discretized time-constant spectrum, obtained
after evaluation
Figure 4: The compact thermal RC ladder model generated
from a measured transient curve
Figure 5: The structure function of a package
Different documents and background information regarding
evaluation of thermal transient curves is available throughout
our web-site.
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