Testimonials

“Novel Approach Offers Significant Improvements in Thermal Interface Material Performance”
(Bruno Michel, Advanced Thermal Packaging Team, IBM Zurich Research Laboratory)

“Philips Use T3Ster to Develop Thermal Models of Chip Packages”
(ir John H.J. Janssen, Manager Virtual Prototyping, Philips Semiconductors, Nijmegen, The Netherlands)

“FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology”
(Tanja Karila, Thermal Specialist, Imbera Electronics Oy, Espoo, Finland)

“T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs)”
(Dr. Thomas Zahner, Quality Manager, Osram Opto Semiconductors GmbH, Regensburg, Germany)