Voltage ranges: 50 mV / 100 mV
/ 200 mV / 400 mV wide window on top of the DC value
of the TSP to measure the temperature change. Automatic
voltage compensation to set the proper range for
a measurement.
Resolution: 12 bit (i.e. LSB corresponds
to 25 µV in the 100 mV range)
Noise: ±1 bit (prior to software
filtering) resulting in an SNR > 70 dB
With a diode sensor having a sensitivity of 2
mV/K the 100 mV measurement range corresponds to
a temperature change of 50 °C, the temperature
resolution is Dtemp = 0.01 °C.
Up to 8 measuring
channels can be installed. On the parallel
channels measurement and data acquisition takes
place simultaneously,
J, K and T type thermocouples can be connected to any of the measuring
channels using the appropriate thermocouple
preamplifier - that is available as an add-on
option. With such an amplifier typical LSB corresponds
to 0.025 °C. Interfacing of certain (thermocouple
compatible) IR sensors is also possible.
Minimal figure of
merit: ~10 000
W/°C (diode measurement without booster).
MEASUREMENT
FEATURES
JEDEC JSD51-1 compliant measurements with
enhanced features.
Smart device calibration, fast thermal
transient measurement:
K-factor is identified at operating current levels.
This way heating curve measurement also takes place
in real-time, "on-the-fly".
Automatic device calibration module is provided
in the measurement control program of T3Ster®.
Besides MicReD's fast, Peltier-based
thermostat (available as an add-on
option) certain Cole-Palmer and Julabo liquid
cooled thermostates are also supported in the software.
(The software can be customized for any RS-232 interfaced
thermostat controlled through ASCII strings.)
Flexible sampling rate:
The sampling rate is controlled by the measurement
software. The hardware supports individual programming
of sampling intervals between 1 µs and 8s.
Typically 200-300 data points are collected in a
decade.
Thus with the highest sampling rate of 1 µs
at the initial part of the thermal transient response,
the measurement grabs the thermal time-constant
range which typically corresponds to the die attach
region of a packaged semiconductor device. This
way, with a sophisticated mathematical post processing
of the measurement results die attach can be qualified.
It applies to stacked die packages as well - at
least for up to 4 die attach layers. Such results
evaluation is provided in the standard T3Ster software as well as in the T3Ster-Master program (available as a software add-on option).
INTERFACE
OPTIONS
Standard
PC ports:
Parallel (real LPT) or USB port of any PC can
be used for data and information transfer between
the T3Ster® Main
System Unit and the measurement control software
running under Windows®. There are
no special requirements against the PC used for
measurement control and results evaluation.
ADD-ON
OPTIONS
- T3Ster-Booster: power
booster unit to extend the power driving capability
of T3Ster®.
- Thermostat
for T3Ster: for easy and quick device
calibration or to be used as a coldplate
- Thermocouple
pre-amplifiers for an easy connection
of any thermocouple type to T3Ster®.
- 1 ft3 still-air chamber according to JEDEC
JESD51-2 document
- Special
fixtures for TIM characterization and
PWB effective thermal conductivity measurement
- TERALED™
accessories for combined ThErmal
and RAdiometric
characterization of high power LED-s
including an integrating sphere, high precision
radiometric detector, temperature stabilized LED
fixture and temperature stabilized reference LED-s
(compliant to CIE recommendations as well).
FURTHER
TECHNICAL DETAILS are available on-line in the T3Ster Reference Guide
|
