T3Ster - Comparison with concurrent products
Data provided below is compiled from publicly available sources, mainly from information available at the web-sites of competing companies. (Product data of concurrent vendors was reviewed in December 2004.)
Product:
T3Ster®
Phase10 Thermal Analyzer
different TTS systems
Company:
MicReD
AnaTech
TEA
Features:
Comparison of system features
Semiconductor DUT structures
diodes, BJT-s, MOSFET-s, test chips, live IC-s, LED-s, thyristors
PN junctions
PN junctions
Thermocouples
J, K, T
with appropriate pre-amplifiers
T
T
Time resolution
(heating curve)
1 µs
3 µs
1.4 µs
Time resolution
(cooling curve)
1 µs
3 µs
5 µs
Actual data recording starts at
1 µs
1 ms
1 ms
Points per time decade
any (up to the max. time resolution or a total of 65k points)
no data available
varying from 1 to 20
Measurement delay time
not applicable since no "pulsing" takes place
no data available
5 µs to 100 µs in 1 µs steps
Measurement method
real-time measurement "on the fly" both for heating and cooling curves (real unit-step response)
series of repeated pulse measurements (thermal impedance curve is artificially composed)
series of repeated pulse measurements (thermal impedance curve is artificially composed)
Max. power
100 W
500 W
100 W
Temperature measurement accuracy
0.01 °C
0.5 °C
0.1 °C
Figure of merit
10 000 W/°C
1 000 W/°C
1 000 W/°C
Signal-to-noise ratio of measurements
higher than 70 dB
no data available
no data available
Number of measurement channels
8 general purpose
8
1 diode, 4 thermocouple
Scaleability
yes, from 1 to 8 channels
no
no
Computer, OS
External PC, any Windows
built-in PC, Win?
built-in PC, Win?
Product:
T3Ster®
Phase10 Thermal Analyzer
different TTS systems
Features:
Comparison of results evaluation
Results evaluation method
mathematical based: NID method
fitting
no
Time constant spectrum
yes
no
no
Complex locus of thermal impedance
yes
no
no
Pulse thermal impedance diagram
yes
yes
no
Structure functions
yes
no data from publicly available sources
no
Dynamic compact models
RC ladders of any number of stages
3 stage RC
no
Rth_ja
yes
yes
yes
Partial thermal resistance
yes
no data from publicly available sources
no
Identification of heat-flow path details
yes
no data from publicly available sources
no
D.A. qualification
yes
yes
yes
Method
detailed qualification through structure function resulting even in DA interface resistance and Rth_ja
Increased total Rth_ja
Increased total Rth_ja
Comment
allows locating the failure
can not distinguish DA void inside the package or soldering delamination outside the package
Software
Win32
Win32
Win32
Results presentation
interactive graphics inside the software, copy/paste opt.
tabular and graphical
tabular, graphics is done via export to Excel
Product:
T3Ster®
Phase10 Thermal Analyzer
different TTS systems
Features:
Add-on options
Thermostat (device TSP calibration unit)
yes (fluid bath unit), but no data available
yes (TTC-100)
Resolution
0.1 °C
no data available
0.1 °C
Accuracy
0.2 °C
no data available
1.4 °C
Range
+5..+90 °C
no data available
-100..+400 °C
Control
through the T3Ster software, RS232
no data available
manual or software via RS232
Power booster
yes
no
Max. power
1000 / 2000 W
1000 / 2000 W
-
Weight
3 kg
388 / 722 kg
-
Power supply
external, usual laboratory supplies can be used
internal
-
Max. figure of merit with boosted power
100 000 / 200 000 W/°C
4 000 W/°C
-
Thermal test chips
yes, TTCS1 series
no
no
Still air chamber
yes, JEDEC standard
yes, JEDEC standard
no
Wind tunnel
no
yes
no
Device fixtures
basic kit is part of any configuration, JEDEC boards are also  available
yes, different kinds (JEDEC compliant)
yes, different kinds (JEDEC compliant)
Comment on device calibration:

In case of MicReD the thermostat unit is used for temperature control only. The change of the TSP measured by the measurement channel(s). In case of other vendors two different TSP measurements take place. On one hand the device calibrator unit measures the change of TSP vs. temperature and on the other hand, during heating curve generation the TSP is measured by the measurement channel of the analyzer or tester. Thus, any error during other vendors' calibration and measurement add while in case of MicReD’s approach possible errors cancel out since for device calibration and for the actual measurement the same unit is used to measure the change of the TSP. That is why other vendors require you to use calibrated voltage and current sources as well as the calibration of the temperature control. In MicReD’s case only the temperature calibration of the device calibrator is needed. This temperature calibration is done before shipment. Calibration certificates are provided on request.

Another important feature of MicReD's TSP calibration procedure is that the temperature sensitivity of the TSP is measured for the actual operating point (operating current) of the semiconductor device to be tested. This means sensitivity either for sensor currents (PN junctions - cooling curve measurement) or for the heating current (any device - heating curve measurement). This is closely related to the "on-the-fly" measurement method used by T3Ster® .
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