T3Ster - the Thermal Transient Tester

T3Ster® [tri-ster], the thermal transient tester of MicReD is a state-of-the-art, scalable and versatile thermal testing station. Its high precision hardware and advanced software provides the best thermal testing solution available worldwide.
 
 
 
 
 
 
 
 
 
 
T3Ster® is aimed at dynamic thermal characterization of packaged semiconductor devices (diodes, BJT-s, J-FET-s and MOSFET-s, thyristors, power LED-s), MCM-s and other electrical or MEMS components. With dedicated fixtures and software, characterization of PWB-s and other substrates or thermal interface materials and/or cooling assemblies is also possible. More info...
ACCURACY, RELIABILITY, VERSATILITY
  • Scalable equipment, hardware and software add-on options
  • Fixtures for special measurements such as thermal interface material (TIM) or characterization, effective board thermal conductivity measurement
  • JEDEC compliant thermal resistance measurements and dynamic characterization
  • Heat-flow path details
  • Measurement control even from your notebook computer
  • Continuous development, solid scientific background & consulting services
 
APPLICATIONS INCLUDE
  • HEAT-FLOW PATH RECONSTRUCTION
  • DIE ATTACH QUALIFICATION
  • TESTING OF STACKED DIE PACKAGES
  • THERMAL STUDY OF HIGH POWER LED-s
  • THERMAL TESTING OF THYRISTORS
  • PARTIAL THERMAL REISTANCE MEASUREMENTS
  • IN-SITU MEASUREMENT OF LIVE IC-s
T3Ster® carries out measurements in real time ("on the fly"). This technique combined with precision hardware results in capturing very accurate, noise-free real thermal transient curves at high time resolution (1 µsec).
Unlike other equipment, T3Ster® really measures the thermal impedance curves rather than artificially composing them from individual responses given to heat-pulses. Compared to other similar equipment, in most parameters T3Ster® provides the best performance.
With the unique evaluation technology of MicReD the T3Ster® software automatically derives the descriptive functions from the thermal transient response of the packaged semiconductor device. These include: the time-constant spectrum, the pulse thermal resistance diagrams, the complex loci of the measured responses, the integral structure function and the differential structure function.
Structure functions allow locating failures in the junction-to-ambient heat-flow path like die attach voids, soldering defects, disintegrity of cooling assemblies, etc. in a non-destructive way.

 

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