What is T3Ster^®?

T3Ster^® (pronounced "Trister") is an advanced thermal tester from MicReD for thermal characterization of semiconductor chip packages.  Using a smart implementation of the JEDEC static-test method (JESD51-1), T3Ster^® forces a packaged semiconductor chip from "cool" to "hot" state using a single step change in input power, and uses the internal transient temperature response curves to generate a complete thermal characterization of a semiconductor chip package in just a few minutes.

Why choose T3Ster^®?

The T3Ster^® equipment is superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01^oC); and its 1 micro-second measurement resolution in time. This combination produces unrivalled accuracy and highly repeatable thermal impedance data. T3Ster^®'s multi-channel architecture enables almost all package varieties to be characterized with the minimum number of measurements, including stacked-die packages, MCMs, LEDs and LED assemblies, etc.