What is T3Ster^®?

T3Ster^® (pronounced "Trister") is an advanced thermal tester from MicReD for thermal characterization of semiconductor chip packages.  Using a smart implementation of the JEDEC static-test method (JESD51-1), T3Ster^® forces a packaged semiconductor chip from "cool" to "hot" state using a single step change in input power, and uses the internal transient temperature response curves to generate a complete thermal characterization of a semiconductor chip package in just a few minutes.

The equipment is available basically in two versions. A simple version of T3Ster^® is aimed at production (in-line) testing with a measurement control software running either in operator or in engineering mode. This way technicians can easily operate the equipment for those quick tests that the thermal engineer has set up. Data evaluation (based on structure functions) is also automatic providing a GO/NOGO signal as a test result. Criteria for this are specified also in the engineering mode of the software.

A sophisticated version of the T3Ster^® equipment is ideal for thermal R&D laboratories. This provides both manual and software controlled modes of operation and all possible powering options. Wide range of configuration options of the equipment is provided. A simple production tester version can be extended and upgraded - even temporarily - to the advanced, R&D version, supporting thermal engineers to properly define testing conditions in production. A detailed selection guide helps in finding the configuration that suits your needs the best.

Why choose T3Ster?

The T3Ster^® equipment is superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01^oC); and its 1 micro-second measurement resolution in time. This combination produces unrivalled accuracy and highly repeatable thermal impedance data. T3Ster^®'s multi-channel architecture enables almost all package varieties to be characterized with the minimum number of measurements, including stacked-die packages, MCMs, LEDs and LED assemblies, etc.