SUNRED
examples |
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The screen
captures below present some typical application fields of SUNRED. We present
some snapshots of the graphical user interface of the
program. SUNRED examples include 2D examples as well as 3D examples.
The advanced
graphical user interface of SUNRED allows
an easy problem definition and an interactive presentation of the simulation
results. Describing the problem in form of bitmap images facilitates a
quick problem input. Different drawing colors mean different materials;
each "pixel" of an "image" corresponds to one grid
cell of the FD mesh. A built-in materials database supports the structure
definition.
The same
look-and-feel is provided throughout the program, on any supported computer
platform. Menus as well as tool-buttons with tool-tips facilitate an easy
navigation. The use of real, microscopic images is facilitated in order
to support the description of the exact geometry of real microstructures.
In the following a few 2D and 3D simulation results are presented.
2D
examples
Study of a cantilever
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Analysis
of a cantilever based on its microscopic image: problem input. Light
green means silicon. |
Analysis
of a cantilever based on its microscopic image: steady-state simulation
results. |
Study of defects
in IC packages
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Heat
streamlines in a chip mounting. Steady-state solution. Effects of
a crack and a soldering void are demonstrated. |
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Moving
of isothermal lines in a chip mounting. Animated results of a transient
solution. Effects of a crack and a soldering void are demonstrated. |
Study of a SIP 9
package
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Analysis
of a SIP9 IC package. The 2D model is based on its cross-sectional
view with a resolution of 512x512 variable grid. |
Steady-state
analysis of a SIP9 IC package. The isothermal lines and heat-flow
streamlines clearly demonstrate the heat conduction path. |
3D examples
Study of a SIP 9
package
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3D model of the SIP9 package is composed of 8 layers of 64x64 pixel
images. The symmetry of the structure is exploited in the model |
3D
steady-state simulation results of the SIP9 package on the 4th layer |
3D
steady-state simulation results of the SIP9 package in axonometric
view |
Study of a DIL IC
package
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3D
steady-state simulation results of a DIL package, axonometric view. |
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