MicReD's
Vendor Workshop at SEMI-THERM 2003: Thermal characterization of cooling assemblies,
power packages and PWB-s |
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The workshop
introduces the hardware and software tools that MicReD provides to the thermal
community for analyzing full range of thermal problems: thermal behavior of
silicon structures, devices, packages, cooling assemblies, printed wiring boards,
enclosures etc.
The product family of our
Thermal Transient Tester - the T3Ster®
equipment will be presented with various application examples such as processor
measurements detached and in working system, identification of multi-surface
dynamic compact models, die attach qualification, determining partial thermal
resistances in the heat-flow path, determining thermal interface resistances,
etc. Examples on the use of structure functions in characterization of packages
and cooling assemblies will also be presented.
The co-simulation of dynamic
compact package models with the detailed thermal models of PWB-s in our board-level
thermal simulator, THERMAN
will be presented, too. This modeling feature allows the accurate calculation
of junction temperature as well as temperature of any other node in packaged
devices on a PWB, under different boundary conditions of both the packages and
the board.
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