MicReD's Vendor Workshop at SEMI-THERM 2002: Tools and methods for thermal characterization of packages and PWB-s

The workshop introduces the new hardware and software tools that MicReD provides for the thermal community for thermal characterization of IC packages and printed wiring boards. We give a detailed look into our scalable, multi-functional thermal test chips TMC9, TMC81 and the wide range of measurement options they provide. The product family of our Thermal Transient Tester – the T3Ster^® equipment will be also presented with various application examples such as die attach qualification, determining partial thermal resistances in the heat-flow path, determining thermal interface resistances, identification of compact models, etc.

Examples that help understanding the use of structure functions will also be presented. A world-novelty, the co-simulation of RC package dynamic compact models with the detailed thermal models of PWB-s in our board-level thermal simulator, THERMAN will be presented, too. This new modeling feature allows the accurate calculation of junction temperature as well as temperature of any other node in packaged devices on a PWB, under different boundary conditions of both the packages and the board.