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The NID method, THERMODEL:
V. Székely: THERMODEL: a tool for compact dynamic thermal
model generation. Proceedings of the 2nd THERMINIC Workshop,
25-27 September, 1996 Budapest, pp. 21-26.
V. Székely: Convolution calculus in the network theory
and identification, Proceedings of the European Conference
on Circuit Theory and Design (ECCTD'97) 30 August - 3 Sept.
1997, Budapest, pp. 49-56.
V. Székely: Identification of RC Networks by Deconvolution:
Chances and Limits, IEEE Transactions on Circuits and Systems-I.
Theory and applications, Vol. 45, No. 3, March 1998, pp. 244-258
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal
evaluation and modelling of MEMS packages. Proceedings of the
4th 2000 IEMT/IMC Symposium, 19-21 April, 2000, Tokyo, Japan,
pp. 326-331
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: A
method for thermal model generation of MEMS packages. Proceedings
of MSM 2000, 28-30 March 2000, San Diego, USA., pp.209-212
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal
evaluation and modelling of the SIP9 and SP10 MEMS packages. Proc.
of the Itherm 2000, May 23-26, Las Vegas, Nevada, USA, pp. 120-126
V. Székely, M. Rencz, A. Poppe, B. Courtois: THERMODEL:
A tool for thermal model generation, and application for MEMS packages, Proceedings of the SPIE DTIP Conference, 9-11 May, 2000,
Paris, France, pp. 39-49
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal evaluation
and modelling of MEMS packages. Proceedings of the 4th 2000 IEMT/IMC
Symposium, 19-21 April, 2000, Tokyo, Japan, pp. 326-331
SUNRED:
V. Székely, M. Rencz: Fast field solver programs for thermal
and electrostatic analysis of microsystem elements, Proceedings
of the IEEE/ACM International Conference on Computer Aided
Design, 9-13 November, 1997, San Jose, CA, USA, pp. 684-689
Zs. Kohári, V. Székely, M. Rencz, V. Dudek, B. Höfflinger: Studies on the heat removal features of stacked SOI structures with
a dedicated field solver program. Proceedings of ESSDERC'97,
27th European Solid-State Device Research Conference, 22-24
September, 1997, Stuttgart, Germany, pp. 496-499
V. Székely: SUNRED: a new thermal simulator and typical
applications, Proceedings of the 3rd THERMINIC Workshop, September 21-23, 1997, Cannes, France, pp. 84-90.
V. Székely, M. Rencz, A. Páhi, A. Poppe, Sz. Hajder: Thermal
simulation tools for microsystem elements. Proceedings of MSM'98,
6-8 April, 1998, Santa Clara, California, USA, pp. 463-468
V. Székely, M. Rencz: Fast Field Solvers for Thermal and
Electrostatic Analysis, Proceedings of DATE'98, 23-26 February,
1998, Paris, France, pp. 518-523
A. Páhi, V. Székely: Efficient thermal simulators: SUNRED
and Quick THERM, Proceedings of the IEEE International Workshop
on Design, Test and Applications, Dubrovnik, Croatia, 8-10 June,
1998, pp. 85-88, ISBN 953-184-009-1
Zs. Kohári, V. Székely, M. Rencz, A. Páhi, V. Dudek, B. Höfflinger: Studies on the heat removal features of stacked SOI structures
with a dedicated field solver program (SUNRED) Journal of Microelectronics
Reliability, 38, 1998, pp. 1881-1891
A. Páhi, V. Székely, M. Rosenthal, M. Rencz: 3D extension
of the SUNRED field solver, Proceedings of the 4th THERMINIC
Workshop, Sept. 27-29, 1998, Cannes, pp. 185-190
V. Székely, A. Páhi, M. Rosenthal, M. Rencz: SUNRED:
a field solver and compact model generator tool based on successive
mode reduction. Proceedings of MSM'99, 19-21 April,
1999, San Juan, Puerto Rico, USA, pp. 342-345
A. Morrissey, J. Alderman, G. Kelly, Zs. Kohári, A. Páhi, M.
Rencz: Packaging and thermal evaluation of thermally operated
intelligent micropump unit. Microelectronics Journal, Vol.
30, No. 11, Nov. 1999, pp. 1109-1114
V. Székely, A. Páhi, M. Rencz: SUNRED, a new field solving
approach. Proceedings of the Symposium on Design, Test
and Microfabrication of MEMS/MOEMS, 30 March - 1 April, 1999,
Paris, France, pp. 278-288
V. Székely, A. Páhi, A. Poppe, M. Rosental, T. Teszéri, M.
Rencz: Thermal time constant analysis and implementation in
the THERMAN and SUNRED thermal simulation tools. Proceedings
of the 5th THERMINIC Workshop, 2-6 October, Rome, Italy, pp.
343-348
M. Rencz, V. Székely, Zs. Kohári, S. Ress, A. Páhi, A. Poppe: Thermal evaluation of the SIP9 package. Proceedings of the
5th THERMINIC Workshop, 2-6 October, Rome, Italy, pp. 111-116
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal
evaluation and modelling of MEMS packages. Proceedings of the
4th 2000 IEMT/IMC Symposium, 19-21 April, 2000, Tokyo, Japan,
pp. 326-331
V. Székely, A. Poppe, M. Rencz: Algorithmic extension of
thermal field solvers: the time constant analysis. Proceedings
of the SEMI-THERM Symposium, 21-23 March, 2000, Double Tree
Hotel, San Jose, CA, USA, pp. 99-106
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: A
method for thermal model generation of MEMS packages. Proceedings
of MSM 2000, 28-30 March 2000, San Diego, USA., pp.209-212
M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal
evaluation and modelling of the SIP9 and SP10 MEMS packages. Proceedings
of Itherm 2000, 23-26 May, 2000, Las Vegas, Nevada, USA, pp.
120-126
V. Székely, A. Poppe, M. Rencz: User friendly thermal simulators
for research and education. Proceedings ISSE 2000, Balatonfüred,
May 6-10. 2000, Hungary.
M. Rencz, V. Székely, A. Poppe, B. Courtois: Friendly tools
for the thermal simulation of power packages. Proceedings of
IWIPP, 14-15 July, 2000. Waltham, MA, USA, pp. 51-54
THERMAN:
V. Székely, A. Csendes, M. Rencz: mS-THERMANAL:
An efficient thermal simulation tool for microsystem elements and
MCM's. Proceedings of the 2nd THERMINIC Workshop,
25-27 September, 1996 Budapest, pp. 13-20
V. Székely, A. Csendes, M. Rencz: mS-THERMANAL:
An efficient thermal simulation tool for microsystem elements and
MCM's. SPIE'96 Symposium on Micromachining and Microfabrication,
14-15 October 1996, Austin, Texas USA, SPIE Proc. Vol. 2880, pp.
64-75.
V. Székely, M. Rencz: Fast field solver programs for thermal
and electrostatic analysis of microsystem elements, Proceedings
of the IEEE/ACM International Conference on Computer Aided
Design, Nov. 9-13, San Jose, CA, USA, pp. 684-689
V. Székely, M. Rencz, A. Páhi, A. Poppe, Sz. Hajder: Thermal
simulation tools for microsystem elements. Proceedings of MSM'98,
April 6-8, 1998, Santa Clara, California, USA, pp. 463-468
V. Székely, M. Rencz: Fast Field Solvers for Thermal and
Electrostatic Analysis, Proceedings of DATE'98, February
23-26, 1998, Paris, France, pp. 518-523
A. Csendes, V. Székely, M. Rencz: An efficient thermal
simulation tool for IC's, microsystem elements and MCM's: the µS-THERMANAL, Microelectronics Journal, Vol. 29, No. 4-5, pp. 241-256, 1998
V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN:
a thermal-simulation tool for IC chips, microstructures and PW boards. Proceedings of MIXDES'99, 6th International Conference, Krakow, Poland, 17-19 June, 1999, pp. 331-336
V. Székely, A. Páhi, A. Poppe, M. Rosental, T. Teszéri, M.
Rencz: Thermal time constant analysis and implementation in
the THERMAN and SUNRED thermal simulation tools. Proceedings
of the 5th THERMINIC Workshop, 2-6 October, Rome, Italy, pp.
343-348
V. Székely, A. Poppe, M. Rencz: Algorithmic
extension of thermal field solvers: the time constant analysis. Proceedings of the SEMI-THERM Symposium, March 21-23, 2000,
Double Tree Hotel, San Jose, CA, USA, pp. 99-106
V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN:
a thermal simulation tool for IC chips, microstructures and PW boards. Microelectronics Reliability, Vol. 40, pp. 517-524, 2000
V. Székely, A. Poppe, M. Rencz: User friendly thermal simulators
for research and education. Proceedings of ISSE 2000, Balatonfüred,
May 6-10. 2000, Hungary.
M. Rencz, V. Székely, A. Poppe, B. Courtois: Friendly tools
for the thermal simulation of power packages. Proceedings of
IWIPP 2000, July 14-15, 2000. Waltham, MA, USA, pp. 51-54
M. Rencz, A. Poppe, V. Székely, B. Courtois: Inclusion
of RC compact models of packages into board level thermal simulation
tools, SEMI-THERM 2002, March 12-14 2002,San Jose, CA,
USA
V. Székely, M. Rencz, A. Poppe, G. Farkas: User friendly
tools for the thermal simulation and modeling of electronic subsystems,
EurosimE 2002, 15-16 April 2002, Paris, France, Proceedings.
M. Rencz, V. Székely, B. Courtois: An algorithm for the
inclusion of RC compact models of packages into board level thermal
simulation tools, Intl. Conference on Modeling and Simulation of
Microsystems, MSM 2002, April 22-25, 2002, San Juan, Puerto Rico,
Proceedings.
Thermal transient testing, evaluation, T3Ster:
V. Székely, M. Rencz, B. Courtois: Thermal transient testing
of the quality of encapsulation. MCM Test Workshop, September
15-18, 1996, Napa, California, pp. 25-31
V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing.
In Proceedings of the 29th International Symposium on Microelectronics,
Minneapolis, Minnesota, USA, 6-10 October, 1996, pp. 18-23
V. Székely: A New Evaluation Method of Thermal Transient
Measurement Results, Microelectronics Journal, Vol. 28, No.
3, pp. 277-292, (1997)
V. Székely, M. Rencz, B. Courtois: Thermal testing methods
to increase system reliability. In Proceedings of SEMI-THERM,
Semiconductor Thermal Measurement and Management Symposium, January
28-30, 1997 Austin, Texas, USA, pp. 210-217
V. Székely, Cs. Márta, M. Rencz, S. Török, G. Farkas: Advances in the thermal testing of ICs, 3rd THERMINIC Workshop, September 21-23, 1997, Cannes, France, pp. 5-10.
V. Székely, M. Rencz, B. Courtois: A Step Forward in the
Transient Thermal Characterization of Packages. 1997 Proceedings
of the International Symposium on Microelectronics (ISHM'97),
Philadelphia, USA, pp. 296-301
V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing. Microelectronics International England, No. 43 May, 1997
V. Székely, M. Rencz, S. Török, G. Végh, Zs. Benedek, Cs. Márta,
J. Mizsei: Advances in the thermal measurement and evaluation
technics, Proceedings of the 4th THERMINIC Workshop, 27-29
September 27-29, 1998, Cannes, France, pp. 5-10.
V. Székely, M. Rencz, B. Courtois: A step forward in the
transient thermal characterization of chips and packages. Microelectronics
Reliability, January 1999, Vol. 39, Nr. 1, pp. 89-96
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek,
B. Courtois, M. Rencz: Transient thermal measurements for dynamic
package modeling: new approaches. Proceedings of the 5th THERMINIC
Workshop, 2-6 October, 1999, Rome, Italy, pp. 7-11
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek,
K. Torki, B. Courtois, M. Rencz: New approaches in the transient
thermal measurements. Microelectronics Journal Vol.3: 9-10,
pp 727-734, 2000.
V. Székely, G. Farkas, É. Nokodémusz, M. Rencz, S. Ress, S.
Török: New procedures for thermal transient testing. Proceedings
of the 6th THERMINIC Workshop, 24-27 September, 2000, Budapest,
Hungary, pp. 15-19
V. Székely, M. Rencz, S. Török, S. Ress, B. Vizy: Experiments
on effective board thermal conductivity measurements. Proceedings
of the 6th THERMINIC Workshop, 24-27 September, 2000, Budapest,
Hungary, pp. 26-30
S. Ress, E. Kollár: Comparison of various thermal transient
measurement methods on a benchmark package. Proceedings of the
6th THERMINIC Workshop, 24-27 September, 2000, Budapest, Hungary,
pp. 120-122
V. Székely, M. Rencz, B. Courtois: New tools for the thermal
transient testing of packages and MCMs. Proceedings of the 7th
Annual KGD Packaging & Test Workshop, September 10-13, 2000.
Napa, CA, USA, pp. 269-284
V. Székely, M. Rencz, A. Poppe, B. Courtois: New hardware
tools for the thermal transient testing of packages, Proceedings
of the 3rd Electronics Packaging Technology Conference, (EPTC)
2000, 5-7 December, 2000, Singapore
M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois: New
tools and methods for the thermal transient testing of packages. HD International 2001. Santa Clara, CA, USA, April 18-20. 2001,
Proceedings pp 268-273
V. Székely, É. Nikodémusz, L. Pohl, M. Rencz: New developments
in thermal transient testing. MIXDES 2001, Zakopane, Poland,
21-23 June, 2001
V. Székely, M. Rencz, L. Pohl: Novelties in the theory
and practice of thermal transient measurements, THERMINIC Workshop,
Sept.24- 27, Paris, France, 2001, Proceedings pp. 239-244
M. Rencz,V. Székely: Determining partial thermal resistances
in a heat flow path with the help of transient measurements, THERMINIC
Workshop, Sept.24-27, Paris, France, 2001,Proceedings pp 250-255
M. Rencz,V. Székely, A. Poppe, G. Farkas, B.Courtois: New
methods and supporting tools for the thermal transient testing of
packages, APACK 2001, Singapore, 5-7 dec. 2001
M. Rencz: Dynamic
Temperature Analysis of Electronic Systems. Future Circuits
International, Issue 7, ISSN:1368-4361, pp 51-54, 2001
V. Székely, M. Rencz, S. Török, S. Ress: Calculating effective
board thermal parameters from transient measurements. Accepted to
the, IEEE Transactions on Components and Packaging Technologies,
Dec.2001
M. Rencz, V. Székely, B. Courtois: Uncovering die attach
problems with the help of thermal transient measurements. SEMICON
WEST 2001, San Jose, CA, USA, July 18-20, 2001, Proceedings
pp 63-76, SEMI
M. Rencz: New possibilities in the thermal evaluation
offered by transient testing, invited talk at THERMES 2002,
January 13-16, 2002,Santa Fe, New Mexico, USA
M. Rencz, V. Székely, A. Morelli, C. Villa: Determining
partial thermal resistances with transient measurements and using
the method to detect die attach discontinuities, SEMI-THERM
2002, March 12-14 2002, San Jose, CA,USA
A. Poppe, V. Székely: Dynamic
Temperature Measurements: Tools Providing a Look into Package and
Mount Structures, Electronics Cooling Magazine, Vol.8, No.2,
May 2002.
M. Rencz: New possibilities in the thermal evaluation offered
by transient testing, invited talk at THERMES 2002, January
13-16, 2002,Santa Fe, New Mexico, USA, printed in the book of "Thermal
Challenges in Next Generation Electronic Systems", ed. Joshi
& Garimella, Millpress 2002 Rotterdam, ISBN 90 77017038, pp 65-74
Thermal
test chips:
V. Székely, Cs. Márta, M. Rencz, G. Végh, Zs. Benedek, S. Török: A Thermal benchmark circuit. Proceedings of the 3rd
THERMINIC Workshop, 21-23 September, 1997, Cannes, France,
pp. 52-54.
V. Székely, Cs. Márta, M. Rencz, S. Török, G. Farkas: Advances
in the thermal testing of ICs, Proceedings of the 3rd
THERMINIC Workshop, 21-23 September, 1997, Cannes, France,
pp. 5-10.
V. Székely, Cs. Márta, M. Rencz, G. Végh, Zs. Benedek, S.
Török: A thermal benchmark chip: design and applications. IEEE
Transactions on Components, Packaging and Manufacturing technology,
Part A, Sept. 1998, Vol. 21, No. 3, pp. 399-405
V. Székely, M. Rencz, B. Courtois: Application results
of a new thermal benchmark chip, Proceedings of the SEMI-THERM
Symposium, 1998, March 1998, San Diego, USA
V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing
Without a Tester, Proceedings of SEMICON West'98, 13-17 July,
1998, San Jose, USA, Proceedings, pp. D1-10/Section II.
A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl,
V. Székely, K. Torki, S. Mir, B. Courtois: Design of a scalable
multi-functional thermal test die with direct and boundary scan
access for programmed excitation and measurement data acquisition. Proceedings of the 6th THERMINIC Workshop, 24-27 September,
Budapest, Hungary, pp. 267-272
M. Rencz: The
increasing importance of thermal test dies. Electronics Cooling,
Vol. 6, Nr. 3, Sept. 2000, pp. 34-42
A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely,
K. Torki, S. Mir, B. Courtois: Design
issues of a multi functional intelligent thermal test die. Proceedings
of the SEMI-THERM 2001, San Jose, CA, USA, March 20-22, 2001
Zs. Benedek, B. Courtois, G. Farkas, E. Kollár, S. Mir, A.
Poppe, M. Rencz, V. Székely, K. Torki: A scalable multi-functional
thermal test chip family: Design and evaluation. Transactions of
the ASME, Journal of Electronic Packaging, Vol 123, No.4, Dec. 2001,
pp 323-330
Temperature
sensors:
V. Székely: CMOS Compatible temperature sensors. Journal
on Communications, Vol. 47, pp. 13-17, May, 1996
V. Székely, Cs. Márta, Zs. Kohári, M. Rencz: New temperature
sensors for DfTT applications. Proceedings of the 2nd THERMINIC
Workshop, 25-27 September, 1996 Budapest, pp. 49-55
V. Székely, M. Rencz, B. Courtois: Integrating on-chip
temperature sensors into DfT schemes and BIST architectures, Proceedings
of the 15th IEEE VLSI Test Symposium, Monterey, Ca, USA,
Apr. 27-30, 1997, pp. 440-446
Cs. Márta, V. Székely, M. Rencz, B. Courtois: Self-Checking
Current Output Temperature Sensor for DfTT. Proceedings of the
3rd IEEE International On-Line Testing Workshop, Aghia Pelaghia,
Crete, Greece, July 7-9, 1997, pp. 75-78
V. Székely, M. Rencz, B. Courtois: Thermal testing of
MCMs using Boundary-Scan access, Proceedings of the Advanced
Technology Workshop, September 14-17, 1997, Napa Valley, California,
USA,
V. Székely, M. Rencz, S. Török, Cs. Márta, L. Lipták-Fegó: CMOS temperature sensors and built-in test circuitry for thermal
testing of ICs, Sensors and Actuators A Physical, Vol. A
71, no. 1-2, Nov. 1998, pp. 10-18.
V. Székely: Thermal testing and control by means of built-in
temperature sensors. Electronics Cooling, Vol. 4, Nr. 3,
September 1998, pp. 36-39
V. Székely, M. Rencz, Cs. Márta, B. Courtois: Thermal
monitoring through boundary scan, Proceedings of the MCM
Test V Advanced Technology Workshop, Napa Valley, CA, Sept.
20-23, 1998, USA - pp.
V. Székely, M. Rencz, A. Páhi, B. Courtois: Thermal monitoring
and testing of electronic systems. IEEE Transactions on Components,
Packaging and Manufacturing Technology, , Vol. 22, No. 2., June
1999, pp. 231-237
Thermal
Transient Measurement Kit - TTMK:
V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing
Without a Tester, Proceedings of SEMICON West'98, 13-17 July,
1998, San Jose, USA, pp. D1-10/Section II.
V. Székely, M. Rencz, B. Courtois: Thermal transient testing
of packages without a tester. Proceedings of IMAPS'98, 1-4 November,
1998, San Diego, USA,
V. Székely: Thermal testing and control by means of built-in
temperature sensors. Electronics Cooling, Vol. 4, Nr. 3,
September 1998, pp. 36-39
V. Székely, M. Rencz, B. Courtois: Thermal transient testing
of packages without a tester. Proceedings of EPTC'98, 8-10 December, 1998, Singapore, Proceedings, pp. 236-239
V. Székely, M. Rencz, B. Courtois: Thermal Transient Evaluation
of Packaging with the TTMK Toolkit. Proceedings of the InterPACK'99
Conference, Maui, Hawaii, USA, June 13-17, 1999, pp. 2199-2206
V. Székely, M. Rencz, B. Courtois: Tool and Method for
the Thermal Transient Evaluation of Packages, Proceedings of
the International Symposium on Microelectronics and Micro-Electromechanical
Systems, 27-29 October, 1999, Royal Pines Resort, Queensland,
Australia, Vol. 3893, pp. 94-103
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek,
B. Courtois, M. Rencz: Transient thermal measurements for dynamic
package modeling: new approaches. Proceedings of the 5th THERMINIC
Workshop, 2-6 October, Rome, Italy, pp. 7-11
V. Székely, M. Rencz, A. Poppe, B. Courtois: New
Way for Thermal Transient Testing. Proceedings of SEMI-THERM,
March, 1999, San Diego, USA, pp. 182-188
A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl,
V. Székely, K. Torki, S. Mir, B. Courtois: Design of a scalable
multi-functional thermal test die with direct and boundary scan
access for programmed excitation and measurement data acquisition. Proceedings of the 6th THERMINIC Workshop, 24-27 September,
Budapest, Hungary, pp. 267-272
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek,
K. Torki, B. Courtois, M. Rencz: New approaches in the transient
thermal measurements. Microelectronics Journal Vol.31:9-10,
pp 727-734, 2000.
Multi-port
compact thermal models, electro-thermal simulation:
M. Rencz, V. Székely: A generic method for thermal multiport
model generation of IC packages. SEMI-THERM 2001, San Jose, CA,
USA, March 20-22, 2001, Proc. pp 145-152
M. Rencz,
V. Székely: Dynamic
thermal multiport modeling of IC packages. Paper that was
winning the 2000 Harvey Rosten Award for Excellence. The
authors received the award at SEMI-THERM 2001.
M. Rencz, V. Székely, B. Courtois: A method for generating
dynamic thermal multiport models of packages. InterPACK'01, Kaual,
Hawaii, USA, July 8-13, 2001
A. Poppe, M. Rencz, V. Székely, G. Mezei: Development of
a platform independent electro-thermal simulator, THERMINIC Workshop,
Sept.24-27, Paris, France, 2001, Proceedings pp 275-280
M. Rencz, V. Székely: Dynamic thermal multiport modeling
of IC packages. IEEE Transactions on Components and Packaging
Technologies, Dec.2001 |
