THERMAN example - the GUI in results presentation mode: thermal transient responses (step responses) at junction nodes of package models and on the substrate

Temperature vs. time plots of step responses (thermal transient heating curves) at different locations of the hybrid IC studied. Both junction temperatures inside transistor packages (T4>J, T1>J) and substrate temperatures at a dissipating shape (R1) are plotted. In the background the steady-state temperature distribution at t=0sec is shown using pseudo-colors.
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